Handbook of Wafer Bonding

Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information.

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  • : 9783527326464
  • : Engels
  • : Hardcover
  • : 425
  • : januari 2012
  • : 932
  • : 246 x 177 x 24 mm.
  • : Materiaalkunde